Method for producing semiconductor device and semiconductor device

ABSTRACT

A method for producing a semiconductor device includes a first step of forming a first insulating film around the fin-shaped semiconductor layer; a second step of forming a pillar-shaped semiconductor layer and a first dummy gate formed of a first polysilicon; a third step of forming a second dummy gate on sidewalls of the first dummy gate and the pillar-shaped semiconductor layer; a fourth step of forming a fifth insulating film left as a sidewall around the second dummy gate, forming a second diffusion layer in an upper portion of the fin-shaped semiconductor layer and a lower portion of the pillar-shaped semiconductor layer, and forming a metal-semiconductor compound on the second diffusion layer; a fifth step of forming a gate electrode and a gate line; and a sixth step of depositing a second gate insulating film around the pillar-shaped semiconductor layer and on the gate electrode and the gate line, removing a portion of the second gate insulating film on the gate line, depositing a second metal, etching back the second metal, removing the second gate insulating film on the pillar-shaped semiconductor layer, depositing a third metal, and etching a portion of the third metal and a portion of the second metal to form a first contact in which the second metal surrounds a sidewall of an upper portion of the pillar-shaped semiconductor layer, a second contact that connects an upper portion of the first contact and an upper portion of the pillar-shaped semiconductor layer, and a third contact made of the second metal and the third metal and formed on the gate line.

CROSS REFERENCES TO RELATED APPLICATIONS

The present application is a continuation application ofPCT/JP2013/069666, filed Jul. 19, 2013, the entire contents of which areincorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a method for producing a semiconductordevice and a semiconductor device.

2. Description of the Related Art

The degree of integration of semiconductor integrated circuits, inparticular, integrated circuits using MOS transistors has beenincreasing. With the increasing degree of integration, the size of MOStransistors used in integrated circuits has been decreased to nano-scaledimensions. Such a decrease in the size of MOS transistors causesdifficulty in suppressing leak currents, which poses a problem in thatit is hard to reduce the area occupied by the circuits because of therequirements of the secure retention of necessary currents. To addressthe problem, a surrounding gate transistor (hereinafter referred to asan “SGT”) having a structure in which a source, a gate, and a drain arearranged vertically with respect to a substrate and a gate electrodesurrounds a pillar-shaped semiconductor layer has been proposed (e.g.,refer to Japanese Unexamined Patent Application Publication Nos.2-71556, 2-188966, and 3-145761).

According to a typical method for producing an SGT, a silicon pillar onwhich a pillar-shaped nitride film hard mask has been formed is formedby using a mask for forming the silicon pillar, a planar silicon layeris formed at a bottom of the silicon pillar by using a mask for formingthe planar silicon layer, and a gate line is formed by using a mask forforming the gate line (e.g., refer to Japanese Unexamined PatentApplication Publication No. 2009-182317).

In other words, three masks are used to form a silicon pillar, a planarsilicon layer, and a gate line.

A metal gate-last process in which a metal gate is formed after ahigh-temperature process has been employed in actual production oftypical MOS transistors in order to achieve both a metal gate processand a high-temperature process (refer to IEDM 2007, K. Mistry et al., pp247-250). A gate is formed using polysilicon, an interlayer insulatingfilm is deposited, the polysilicon gate is exposed by chemicalmechanical polishing and etched, and then a metal is deposited. Thus, ametal gate-last process in which a metal gate is formed after ahigh-temperature process needs to be also employed in making SGTs inorder to achieve both a metal gate process and a high-temperatureprocess.

In a metal gate-last process, a diffusion layer is formed by ionimplantation after formation of a polysilicon gate. Specialconsideration is necessary for SGTs because the upper portion of thepillar-shaped silicon layer is covered with a polysilicon gate.

As the width of a silicon pillar decreases, it becomes more difficult tomake an impurity be present in the silicon pillar because the density ofsilicon is 5×10²²/cm³.

In typical SGTs, it has been proposed that the channel concentration isset to be a low impurity concentration of 10¹⁷ cm⁻³ or less and thethreshold voltage is determined by changing the work function of a gatematerial (e.g., refer to Japanese Unexamined Patent ApplicationPublication No. 2004-356314).

It has been disclosed that, in planar MOS transistors, the sidewall ofan LDD region is formed of a polycrystalline silicon having the sameconductivity type as a low-concentration layer, and therefore surfacecarriers of the LDD region are induced by the difference in workfunction and the impedance of the LDD region can be reduced comparedwith oxide film sidewall LDD-type MOS transistors (e.g., refer toJapanese Unexamined Patent Application Publication No. 11-297984). Ithas also been disclosed that the polycrystalline silicon sidewall iselectrically insulated from a gate electrode. The drawings show that thepolycrystalline silicon sidewall is insulated from a source and a drainby an interlayer insulating film.

In typical MOS transistors, a first insulating film is used to decreaseparasitic capacitance between the gate line and the substrate. Forexample, in a FINFET (refer to IEDM 2010 CC. Wu, et al., 27.1.1-27.1.4),a first insulating film is formed around one fin-shaped semiconductorlayer and etched back to expose the fin-shaped semiconductor layer inorder to decrease parasitic capacitance between the gate line and thesubstrate. Accordingly, the first insulating film needs to be also usedin an SGT in order to decrease parasitic capacitance between the gateline and the substrate. Since such an SGT includes a pillar-shapedsemiconductor layer in addition to a fin-shaped semiconductor layer,special consideration is required to form the pillar-shapedsemiconductor layer.

SUMMARY OF THE INVENTION

It is desirable to provide a method for producing an SGT which includesforming a fin-shaped semiconductor layer, a pillar-shaped semiconductorlayer, a gate electrode, and a gate line using two masks and whichemploys a gate last process and a self-aligned process, the SGT having astructure in which an upper portion of the pillar-shaped semiconductorlayer is made to function as an n-type semiconductor layer or a p-typesemiconductor layer by the difference in work function between metal andsemiconductor. It is also desirable to provide an SGT structure obtainedby this method.

A method for producing a semiconductor device according to a firstaspect of the present invention includes a first step of forming afin-shaped semiconductor layer on a semiconductor substrate and forminga first insulating film around the fin-shaped semiconductor layer; asecond step following the first step, the second step including forminga pillar-shaped semiconductor layer and a first dummy gate formed of afirst polysilicon; a third step following the second step, the thirdstep including forming a second dummy gate on sidewalls of the firstdummy gate and the pillar-shaped semiconductor layer; a fourth stepfollowing the third step, the fourth step including forming a fifthinsulating film left as a sidewall around the second dummy gate, forminga second diffusion layer in an upper portion of the fin-shapedsemiconductor layer and a lower portion of the pillar-shapedsemiconductor layer, and forming a metal-semiconductor compound on thesecond diffusion layer; a fifth step following the fourth step, thefifth step including depositing an interlayer insulating film, exposingan upper portion of the second dummy gate and an upper portion of thefirst dummy gate, removing the second dummy gate and the first dummygate, forming a first gate insulating film around the pillar-shapedsemiconductor layer and on inner sides of the fifth insulating film,depositing a first metal, and forming a gate electrode and a gate line;and a sixth step following the fifth step, the sixth step includingdepositing a second gate insulating film around the pillar-shapedsemiconductor layer and on the gate electrode and the gate line,removing a portion of the second gate insulating film on the gate line,depositing a second metal, etching back the second metal, removing thesecond gate insulating film on the pillar-shaped semiconductor layer,depositing a third metal, and etching a portion of the third metal and aportion of the second metal to form a first contact in which the secondmetal surrounds a sidewall of an upper portion of the pillar-shapedsemiconductor layer, a second contact that connects an upper portion ofthe first contact and an upper portion of the pillar-shapedsemiconductor layer, and a third contact made of the second metal andthe third metal and formed on the gate line.

The second step may include forming a second insulating film around thefin-shaped semiconductor layer, depositing the first polysilicon on thesecond insulating film to perform planarization, forming a second resistfor forming the gate line and the pillar-shaped semiconductor layer sothat the second resist extends in a direction perpendicular to adirection in which the fin-shaped semiconductor layer extends, andetching the first polysilicon, the second insulating film, and thefin-shaped semiconductor layer to form the pillar-shaped semiconductorlayer and the first dummy gate formed of the first polysilicon.

The third step may include forming a fourth insulating film around thepillar-shaped semiconductor layer and the first dummy gate, depositing asecond polysilicon around the fourth insulating film, and etching thesecond polysilicon so that the second polysilicon is left on sidewallsof the first dummy gate and the pillar-shaped semiconductor layer toform the second dummy gate.

The fourth step may include forming the fifth insulating film around thesecond dummy gate, etching the fifth insulating film into a sidewallshape so that a sidewall formed of the fifth insulating film is formed,forming the second diffusion layer in the upper portion of thefin-shaped semiconductor layer and the lower portion of thepillar-shaped semiconductor layer, and forming the metal-semiconductorcompound on the second diffusion layer.

The fifth step may include depositing an interlayer insulating film,performing chemical mechanical polishing to expose an upper portion ofthe second dummy gate and an upper portion of the first dummy gate,removing the second dummy gate and the first dummy gate, removing thefourth insulating film, forming a first gate insulating film around thepillar-shaped semiconductor layer and on inner sides of the fifthinsulating film, depositing a first metal, and etching back the firstmetal to form the gate electrode and the gate line.

The second step may further include forming a third insulating film onthe first polysilicon after depositing the first polysilicon on thesecond insulating film to perform planarization.

The method may further include, after the fourth step, depositing acontact stopper film.

The method may further include, after the fifth step, removing the firstgate insulating film.

A metal that forms the first contact may have a work function of 4.0 eVto 4.2 eV.

A metal that forms the first contact may have a work function of 5.0 eVto 5.2 eV.

A semiconductor device according to a second aspect of the presentinvention includes a pillar-shaped semiconductor layer; a first gateinsulating film formed around the pillar-shaped semiconductor layer; agate electrode made of a metal and formed around the first gateinsulating film; a gate line made of a metal and connected to the gateelectrode; a second gate insulating film formed around a sidewall of anupper portion of the pillar-shaped semiconductor layer; a first contactmade of a second metal and formed around the second gate insulatingfilm; a second contact made of a third metal and connecting an upperportion of the first contact and an upper portion of the pillar-shapedsemiconductor layer; and a third contact made of the second metal andthe third metal and formed on the gate line.

The semiconductor device may include a fin-shaped semiconductor layerformed on a semiconductor substrate; a first insulating film formedaround the fin-shaped semiconductor layer; and a second diffusion layerformed in an upper portion of the fin-shaped semiconductor layer and alower portion of the pillar-shaped semiconductor layer. Thepillar-shaped semiconductor layer is formed on the fin-shapedsemiconductor layer, the first gate insulating film is formed around andat bottoms of the gate electrode and the gate line, and the gate lineextends in a direction perpendicular to a direction in which thefin-shaped semiconductor layer extends.

A width of the first contact in a direction perpendicular to a directionin which the gate line extends may be equal to a width of the thirdcontact in the direction perpendicular to the direction in which thegate line extends.

A width of the first contact in a direction perpendicular to a directionin which the gate line extends may be equal to a width of the gate linein the direction perpendicular to the direction in which the gate lineextends.

A width of the third contact in a direction perpendicular to a directionin which the gate line extends may be equal to a width of the gate linein the direction perpendicular to the direction in which the gate lineextends.

A width of the first contact in a direction perpendicular to a directionin which the gate line extends may be equal to a width of the secondcontact in the direction perpendicular to the direction in which thegate line extends.

The second gate insulating film may be formed around and at a bottom ofthe first contact.

The second metal that forms the first contact may have a work functionof 4.0 eV to 4.2 eV.

The second metal that forms the first contact may have a work functionof 5.0 eV to 5.2 eV.

The present invention can provide a method for producing an SGT whichincludes forming a fin-shaped semiconductor layer, a pillar-shapedsemiconductor layer, a gate electrode, and a gate line using two masksand which employs a gate last process and a self-aligned process, theSGT having a structure in which an upper portion of the pillar-shapedsemiconductor layer is made to function as an n-type semiconductor layeror a p-type semiconductor layer by the difference in work functionbetween metal and semiconductor. The present invention can also providean SGT structure obtained by the method.

A fin-shaped semiconductor layer, a pillar-shaped semiconductor layer,and first and second dummy gates which will later form a gate electrodeand a gate line can be formed using two masks through the followingsteps: the first step of forming a fin-shaped semiconductor layer on asemiconductor substrate and forming a first insulating film around thefin-shaped semiconductor layer; the second step following the firststep, the second step including forming a pillar-shaped semiconductorlayer and a first dummy gate formed of a first polysilicon; the thirdstep following the second step, the third step including forming asecond dummy gate on sidewalls of the first dummy gate and thepillar-shaped semiconductor layer; the fourth step following the thirdstep, the fourth step including forming a fifth insulating film left asa sidewall around the second dummy gate, forming a second diffusionlayer in an upper portion of the fin-shaped semiconductor layer and alower portion of the pillar-shaped semiconductor layer, and forming ametal-semiconductor compound on the second diffusion layer; and thefifth step following the fourth step, the fifth step includingdepositing an interlayer insulating film, exposing an upper portion ofthe second dummy gate and an upper portion of the first dummy gate,removing the second dummy gate and the first dummy gate, forming a firstgate insulating film around the pillar-shaped semiconductor layer and oninner sides of the fifth insulating film, depositing a first metal, andetching back the first metal to form a gate electrode and a gate line.Thus, the number of steps can be decreased.

Misalignment between the pillar-shaped semiconductor layer and the gateline can be eliminated.

Furthermore, a metal gate SGT can be easily formed because a typicalmetal gate-last production process can be used which includes forming afirst dummy gate and a second dummy gate using polysilicon, depositingan interlayer insulating film, exposing the first dummy gate and thesecond dummy gate by chemical mechanical etching, etching thepolysilicon gate, and then depositing a metal.

There is no need to form a diffusion layer in an upper portion of thepillar-shaped semiconductor layer due to the sixth step that follows thefifth step and includes removing the exposed first gate insulating film,depositing a second gate insulating film around the pillar-shapedsemiconductor layer and on the gate electrode and the gate line,removing a portion of the second gate insulating film on the gate line,depositing a second metal, etching back the second metal, removing thesecond gate insulating film on the pillar-shaped semiconductor layer,depositing a third metal, and etching a portion of the third metal and aportion of the second metal to form a first contact in which the secondmetal surrounds a sidewall of an upper portion of the pillar-shapedsemiconductor layer, a second contact that connects an upper portion ofthe first contact and an upper portion of the pillar-shapedsemiconductor layer, and a third contact made of the second metal andthe third metal and formed on the gate line. At the same time, a contacton the gate line can also be formed.

After the fifth step, a hole having the same shape as those of the gateelectrode and the gate line is left above the gate electrode and thegate line. Therefore, the hole having the same shape as those of thegate electrode and the gate line is filled with a metal by removing theexposed first gate insulating film, depositing a second gate insulatingfilm around the pillar-shaped semiconductor layer and on the gateelectrode and the gate line, removing a portion of the second gateinsulating film on the gate line, depositing a second metal, and etchingback the second metal. As a result, a first contact in which the secondmetal surrounds a sidewall of an upper portion of the pillar-shapedsemiconductor layer can be formed by self-alignment.

Since a portion of the second gate insulating film on the gate line isremoved, a third contact for the gate line can be formed at the sametime. Thus, a contact for the gate line can be easily formed.

If a metal gate-last process is used for an SGT, an upper portion of thepillar-shaped semiconductor layer is covered with a polysilicon gate.Therefore, it is difficult to form a diffusion layer in the upperportion of the pillar-shaped semiconductor layer. This requiresformation of a diffusion layer in the upper portion of the pillar-shapedsemiconductor layer before formation of a polysilicon gate. In contrast,according to the present invention, the upper portion of thepillar-shaped semiconductor layer can be made to function as an n-typesemiconductor layer or a p-type semiconductor layer by the difference inwork function between metal and semiconductor without forming adiffusion layer in the upper portion of the pillar-shaped semiconductorlayer. Accordingly, a step of forming a diffusion layer in the upperportion of the pillar-shaped semiconductor layer can be omitted.

The first gate insulating film formed around and at bottoms of the gateelectrode and the gate line can insulate the gate electrode and the gateline from the pillar-shaped semiconductor layer and the fin-shapedsemiconductor layer.

After the fifth step, the first contact, the second contact, and thethird contact are formed by filling a hole which is present above thegate electrode and the gate line and which has the same shape as thoseof the gate electrode and the gate line. Therefore, the width of thefirst contact in a direction perpendicular to a direction in which thegate line extends is equal to the width of the third contact in thedirection perpendicular the direction in which the gate line extends.The width of the first contact in the direction perpendicular to thedirection in which the gate line extends is equal to the width of thegate line in the direction perpendicular to the direction in which thegate line extends. The width of the third contact in the directionperpendicular to the direction in which the gate line extends is equalto the width of the gate line in the direction perpendicular to thedirection in which the gate line extends. The width of the first contactin the direction perpendicular to the direction in which the gate lineextends is equal to the width of the second contact in the directionperpendicular to the direction in which the gate line extends.

Accordingly, misalignment between the first contact, the second contact,and the third contact can be eliminated in a direction perpendicular tothe direction in which the gate line extends.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a plan view illustrating a semiconductor device according toan embodiment of the present invention, FIG. 113 is a sectional viewtaken along line X-X′ in FIG. 1A, and FIG. 1C is a sectional view takenalong line Y-Y′ in FIG. 1A.

FIG. 2A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 2B is a sectional view taken along line X-X′ in FIG. 2A,and FIG. 2C is a sectional view taken along line Y-Y′ in FIG. 2A.

FIG. 3A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 3B is a sectional view taken along line X-X′ in FIG. 3A,and FIG. 3C is a sectional view taken along line Y-Y′ in FIG. 3A.

FIG. 4A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 4B is a sectional view taken along line X-X′ in FIG. 4A,and FIG. 4C is a sectional view taken along line Y-Y′ in FIG. 4A.

FIG. 5A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 5B is a sectional view taken along line X-X′ in FIG. 5A,and FIG. 5C is a sectional view taken along line Y-Y′ in FIG. 5A.

FIG. 6A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 6B is a sectional view taken along line X-X′ in FIG. 6A,and FIG. 6C is a sectional view taken along line Y-Y′ in FIG. 6A.

FIG. 7A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 7B is a sectional view taken along line X-X′ in FIG. 7A,and FIG. 7C is a sectional view taken along line Y-Y′ in FIG. 7A.

FIG. 8A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 8B is a sectional view taken along line X-X′ in FIG. 8A,and FIG. 8C is a sectional view taken along line Y-Y′ in FIG. 8A.

FIG. 9A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 9B is a sectional view taken along line X-X′ in FIG. 9A,and FIG. 9C is a sectional view taken along line Y-Y′ in FIG. 9A.

FIG. 10A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 10B is a sectional view taken along line X-X′ in FIG.10A, and FIG. 10C is a sectional view taken along line Y-Y′ in FIG. 10A.

FIG. 11A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 11B is a sectional view taken along line X-X′ in FIG.11A, and FIG. 11C is a sectional view taken along line Y-Y′ in FIG. 11A.

FIG. 12A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 12B is a sectional view taken along line X-X′ in FIG.12A, and FIG. 12C is a sectional view taken along line Y-Y′ in FIG. 12A.

FIG. 13A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 13B is a sectional view taken along line X-X′ in FIG.13A, and FIG. 13C is a sectional view taken along line Y-Y′ in FIG. 13A.

FIG. 14A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 14B is a sectional view taken along line X-X′ in FIG.14A, and FIG. 14C is a sectional view taken along line Y-Y′ in FIG. 14A.

FIG. 15A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 15B is a sectional view taken along line X-X′ in FIG.15A, and FIG. 15C is a sectional view taken along line Y-Y′ in FIG. 15A.

FIG. 16A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 16B is a sectional view taken along line X-X′ in FIG.16A, and FIG. 16C is a sectional view taken along line Y-Y′ in FIG. 16A.

FIG. 17A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 17B is a sectional view taken along line X-X′ in FIG.17A, and FIG. 17C is a sectional view taken along line Y-Y′ in FIG. 17A.

FIG. 18A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 18B is a sectional view taken along line X-X′ in FIG.18A, and FIG. 18C is a sectional view taken along line Y-Y′ in FIG. 18A.

FIG. 19A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 19B is a sectional view taken along line X-X′ in FIG.19A, and FIG. 19C is a sectional view taken along line Y-Y′ in FIG. 19A.

FIG. 20A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 20B is a sectional view taken along line X-X′ in FIG.20A, and FIG. 20C is a sectional view taken along line Y-Y′ in FIG. 20A.

FIG. 21A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 21B is a sectional view taken along line X-X′ in FIG.21A, and FIG. 21C is a sectional view taken along line Y-Y′ in FIG. 21A.

FIG. 22A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 22B is a sectional view taken along line X-X′ in FIG.22A, and FIG. 22C is a sectional view taken along line Y-Y′ in FIG. 22A.

FIG. 23A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 23B is a sectional view taken along line X-X′ in FIG.23A, and FIG. 23C is a sectional view taken along line Y-Y′ in FIG. 23A.

FIG. 24A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 24B is a sectional view taken along line X-X′ in FIG.24A, and FIG. 24C is a sectional view taken along line Y-Y′ in FIG. 24A.

FIG. 25A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 25B is a sectional view taken along line X-X′ in FIG.25A, and FIG. 25C is a sectional view taken along line Y-Y′ in FIG. 25A.

FIG. 26A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 26B is a sectional view taken along line X-X′ in FIG.26A, and FIG. 26C is a sectional view taken along line Y-Y′ in FIG. 26A.

FIG. 27A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 27B is a sectional view taken along line X-X′ in FIG.27A, and FIG. 27C is a sectional view taken along line Y-Y′ in FIG. 27A.

FIG. 28A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 28B is a sectional view taken along line X-X′ in FIG.28A, and FIG. 28C is a sectional view taken along line Y-Y′ in FIG. 28A.

FIG. 29A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 29B is a sectional view taken along line X-X′ in FIG.29A, and FIG. 29C is a sectional view taken along line Y-Y′ in FIG. 29A.

FIG. 30A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 30B is a sectional view taken along line X-X′ in FIG.30A, and FIG. 30C is a sectional view taken along line Y-Y′ in FIG. 30A.

FIG. 31A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 31B is a sectional view taken along line X-X′ in FIG.31A, and FIG. 31C is a sectional view taken along line Y-Y′ in FIG. 31A.

FIG. 32A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 32B is a sectional view taken along line X-X′ in FIG.32A, and FIG. 32C is a sectional view taken along line Y-Y′ in FIG. 32A.

FIG. 33A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 33B is a sectional view taken along line X-X′ in FIG.33A, and FIG. 33C is a sectional view taken along line Y-Y′ in FIG. 33A.

FIG. 34A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 34B is a sectional view taken along line X-X′ in FIG.34A, and FIG. 34C is a sectional view taken along line Y-Y′ in FIG. 34A.

FIG. 35A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 35B is a sectional view taken along line X-X′ in FIG.35A, and FIG. 35C is a sectional view taken along line Y-Y′ in FIG. 35A.

FIG. 36A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 36B is a sectional view taken along line X-X′ in FIG.36A, and FIG. 36C is a sectional view taken along line Y-Y′ in FIG. 36A.

FIG. 37A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 37B is a sectional view taken along line X-X′ in FIG.37A, and FIG. 37C is a sectional view taken along line Y-Y′ in FIG. 37A.

FIG. 38A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 38B is a sectional view taken along line X-X′ in FIG.38A, and FIG. 38C is a sectional view taken along line Y-Y′ in FIG. 38A.

FIG. 39A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 39B is a sectional view taken along line X-X′ in FIG.39A, and FIG. 39C is a sectional view taken along line Y-Y′ in FIG. 39A.

FIG. 40A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 40B is a sectional view taken along line X-X′ in FIG.40A, and FIG. 40C is a sectional view taken along line Y-Y′ in FIG. 40A.

FIG. 41A is a plan view illustrating a method for producing asemiconductor device according to an embodiment of the presentinvention, FIG. 41B is a sectional view taken along line X-X′ in FIG.41A, and FIG. 41C is a sectional view taken along line Y-Y′ in FIG. 41A.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereafter, a production process for forming an SGT structure accordingto an embodiment of the present invention will be described withreference to FIG. 2A to FIG. 41C.

Described first is a first step that includes forming a fin-shapedsemiconductor layer on a semiconductor substrate and forming a firstinsulating film around the fin-shaped semiconductor layer. In thisembodiment, a silicon substrate is used, but any semiconductor substrateother than the silicon substrate may be used.

As illustrated in FIGS. 2A to 2C, a first resist 102 for forming afin-shaped silicon layer is formed on a silicon substrate 101.

As illustrated in FIGS. 3A to 3C, the silicon substrate 101 is etched toform a fin-shaped silicon layer 103. Herein, the fin-shaped siliconlayer has been formed using a resist as a mask, but a hard mask such asan oxide film or a nitride film may be used.

As illustrated in FIGS. 4A to 4C, the first resist 102 is removed.

As illustrated in FIGS. 5A to 5C, a first insulating film 104 isdeposited around the fin-shaped silicon layer 103. An oxide film formedby high-density plasma or an oxide film formed by low-pressure chemicalvapor deposition (CVD) may be used as the first insulating film.

As illustrated in FIGS. 6A to 6C, the first insulating film 104 isetched back to expose an upper portion of the fin-shaped silicon layer103. The process so far is the same as that of a method for making afin-shaped silicon layer in IEDM 2010 CC. Wu, et al., 27.1.1-27.1.4.

The description so far has shown a first step that includes forming afin-shaped silicon layer 103 on a silicon substrate 101 and forming afirst insulating film 104 around the fin-shaped silicon layer 103.

Described next is a second step that includes forming a secondinsulating film around the fin-shaped semiconductor layer, depositing afirst polysilicon on the second insulating film to performplanarization, forming a second resist for forming a gate line and apillar-shaped semiconductor layer so that the second resist extends in adirection perpendicular to a direction in which the fin-shapedsemiconductor layer extends, and etching the first polysilicon, thesecond insulating film, and the fin-shaped semiconductor layer to form apillar-shaped semiconductor layer and a first dummy gate formed of thefirst polysilicon.

As illustrated in FIGS. 7A to 7C, a second insulating film 105 is formedaround the fin-shaped silicon layer 103. The second insulating film 105is preferably an oxide film.

As illustrated in FIGS. 8A to 8C, a first polysilicon 106 is depositedon the second insulating film 105 to perform planarization.

As illustrated in FIGS. 9A to 9C, a third insulating film 107 is formedon the first polysilicon 106. The third insulating film 107 ispreferably a nitride film.

As illustrated in FIGS. 10A to 10C, a second resist 108 for forming agate line and a pillar-shaped silicon layer is formed so that the secondresist 108 extends in a direction perpendicular to a direction in whichthe fin-shaped silicon layer 103 extends.

As illustrated in FIGS. 11A to 11C, the third insulating film 107, thefirst polysilicon 106, the second insulating film 105, and thefin-shaped silicon layer 103 are etched to form a pillar-shaped siliconlayer 109 and a first dummy gate 106 formed of the first polysilicon.Herein, if the second resist is removed during the etching, the thirdinsulating film 107 functions as a hard mask. If the second resist isnot removed during the etching, the third insulating film is notnecessarily used.

As illustrated in FIGS. 12A to 12C, the second resist 108 is removed.

The description so far has shown a second step that includes forming asecond insulating film around the fin-shaped semiconductor layer,depositing a first polysilicon on the second insulating film to performplanarization, forming a second resist for forming a gate line and apillar-shaped semiconductor layer so that the second resist extends in adirection perpendicular to a direction in which the fin-shapedsemiconductor layer extends, and etching the first polysilicon, thesecond insulating film, and the fin-shaped semiconductor layer to form apillar-shaped semiconductor layer and a first dummy gate formed of thefirst polysilicon.

Described next is a third step that follows the second step and includesforming a fourth insulating film around the pillar-shaped semiconductorlayer and the first dummy gate, depositing a second polysilicon aroundthe fourth insulating film, and etching the second polysilicon so thatthe second polysilicon is left on sidewalls of the first dummy gate andthe pillar-shaped semiconductor layer to form a second dummy gate.

As illustrated in FIGS. 13A to 13C, a fourth insulating film 110 isformed around the pillar-shaped silicon layer 109 and the first dummygate 106. The fourth insulating film 110 is preferably an oxide film.

As illustrated in FIGS. 14A to 14C, a second polysilicon 113 isdeposited around the fourth insulating film 110.

As illustrated in FIGS. 15A to 15C, the second polysilicon 113 is etchedso as to be left on sidewalls of the first dummy gate 106 and thepillar-shaped silicon layer 109 to form a second dummy gate 113.

The description so far has shown a third step that follows the secondstep and includes forming a fourth insulating film around thepillar-shaped semiconductor layer and the first dummy gate, depositing asecond polysilicon around the fourth insulating film, and etching thesecond polysilicon so that the second polysilicon is left on sidewallsof the first dummy gate and the pillar-shaped semiconductor layer toform a second dummy gate.

Described next is a fourth step that includes forming a fifth insulatingfilm around the second dummy gate, etching the fifth insulating filminto a sidewall shape so that a sidewall formed of the fifth insulatingfilm is formed, forming a second diffusion layer in an upper portion ofthe fin-shaped semiconductor layer and a lower portion of thepillar-shaped semiconductor layer, and forming a metal-semiconductorcompound on the second diffusion layer.

As illustrated in FIGS. 16A to 16C, a fifth insulating film 114 isformed around the second dummy gate 113. The fifth insulating film 114is preferably a nitride film.

As illustrated in FIGS. 17A to 17C, the fifth insulating film 114 isetched so as to be left as a sidewall. As a result, a sidewall 114formed of the fifth insulating film is formed.

As illustrated in FIGS. 18A to 18C, an impurity is introduced to form asecond diffusion layer 115 in an upper portion of the fin-shaped siliconlayer 103 and a lower portion of the pillar-shaped silicon layer 109.Arsenic or phosphorus is preferably introduced to form an n-typediffusion layer. Boron is preferably introduced to form a p-typediffusion layer. The introduction of the impurity may be performedbefore the formation of the fifth insulating film.

As illustrated in FIGS. 19A to 19C, a metal-semiconductor compound 116is formed on the second diffusion layer 115. A metal-semiconductorcompound 117 is also formed in an upper portion of the second dummy gate113.

The description so far has shown a fourth step that includes forming afifth insulating film around the second dummy gate, etching the fifthinsulating film into a sidewall shape so that a sidewall formed of thefifth insulating film is formed, forming a second diffusion layer in anupper portion of the fin-shaped semiconductor layer and a lower portionof the pillar-shaped semiconductor layer, and forming ametal-semiconductor compound on the second diffusion layer.

Described next is a fifth step that follows the fourth step and includesdepositing an interlayer insulating film, exposing an upper portion ofthe second dummy gate and an upper portion of the first dummy gate,removing the second dummy gate and the first dummy gate, forming a firstgate insulating film around the pillar-shaped semiconductor layer and oninner sides of the fifth insulating film, depositing a first metal, andforming a gate electrode and a gate line.

As illustrated in FIGS. 20A to 20C, a contact stopper film 118 isdeposited and an interlayer insulating film 119 is deposited. Thecontact stopper film 118 is preferably a nitride film. There is no needto use the contact stopper film if etching of contact holes can becontrolled.

As illustrated in FIGS. 21A to 21C, chemical mechanical polishing isperformed to expose an upper portion of the second dummy gate 113 and anupper portion of the first dummy gate 106. During this process, themetal-semiconductor compound 117 formed in the upper portion of thesecond dummy gate 113 is removed.

As illustrated in FIGS. 22A to 22C, the second dummy gate 113 and thefirst dummy gate 106 are removed.

As illustrated in FIGS. 23A to 23C, the second insulating film 105 andthe fourth insulating film 110 are removed.

As illustrated in FIGS. 24A to 24C, a first gate insulating film 120 isformed around the pillar-shaped silicon layer 109 and on inner sides ofthe fifth insulating film 114, and a first metal 121 is deposited. Agate electrode 121 a is formed around the pillar-shaped silicon layer109. A gate line 121 b is also formed. Since the first gate insulatingfilm 120 is formed around and at bottoms of the gate electrode 121 a andthe gate line 121 b, the gate electrode 121 a and the gate line 121 bcan be insulated from the pillar-shaped silicon layer 109 and thefin-shaped silicon layer 103.

As illustrated in FIGS. 25A to 25C, the first metal 121 is etched backto expose an upper portion of the pillar-shaped silicon layer 109.

The description so far has shown a fifth step that follows the fourthstep and includes depositing an interlayer insulating film, exposing anupper portion of the second dummy gate and an upper portion of the firstdummy gate, removing the second dummy gate and the first dummy gate,forming a first gate insulating film around the pillar-shapedsemiconductor layer and on inner sides of the fifth insulating film,depositing a first metal, and forming a gate electrode and a gate line.

Described next is a sixth step that includes depositing a second gateinsulating film around the pillar-shaped semiconductor layer and on thegate electrode and the gate line, removing a portion of the second gateinsulating film on the gate line, depositing a second metal, etchingback the second metal, removing the second gate insulating film on thepillar-shaped semiconductor layer, depositing a third metal, and etchinga portion of the third metal and a portion of the second metal to form afirst contact in which the second metal surrounds a sidewall of an upperportion of the pillar-shaped semiconductor layer, a second contact thatconnects an upper portion of the first contact and an upper portion ofthe pillar-shaped semiconductor layer, and a third contact made of thesecond metal and the third metal and formed on the gate line.

As illustrated in FIGS. 26A to 26C, the exposed first gate insulatingfilm 120 is removed.

As illustrated in FIGS. 27A to 27C, a second gate insulating film 123 isdeposited around the pillar-shaped silicon layer 109 and on the gateelectrode 121 a and the gate line 121 b.

As illustrated in FIGS. 28A to 28C, a third resist 124 for removing aportion of the second gate insulating film 123 on the gate line 121 b isformed.

As illustrated in FIGS. 29A to 29C, a portion of the second gateinsulating film 123 on the gate line 121 b is removed.

As illustrated in FIGS. 30A to 30C, the third resist 124 is removed.

As illustrated in FIGS. 31A to 31C, a second metal 125 is deposited.When the transistor is an n-type transistor, the work function of thesecond metal 125 is preferably 4.0 eV to 4.2 eV. When the transistor isa p-type transistor, the work function of the second metal 125 ispreferably 5.0 eV to 5.2 eV.

As illustrated in FIGS. 32A to 32C, the second metal 125 is etched backto expose the second gate insulating film 123 on the pillar-shapedsilicon layer 109.

As illustrated in FIGS. 33A to 33C, the exposed second gate insulatingfilm 123 on the pillar-shaped silicon layer 109 is removed.

As illustrated in FIGS. 34A to 34C, a third metal 126 is deposited. Thethird metal may be the same as the second metal.

As illustrated in FIGS. 35A to 35C, a fourth resist 127 for forming acontact hole is formed.

As illustrated in FIGS. 36A to 36C, the interlayer insulating film 119and the contact stopper film 118 are etched to form a contact hole 128.

As illustrated in FIGS. 37A to 37C, the fourth resist 127 is removed.

As illustrated in FIGS. 38A to 38C, a fourth metal 130 for metal wiringsis deposited. Herein, a contact 129 is formed.

As illustrated in FIGS. 39A to 39C, fifth resists 131, 132, and 133 forforming metal wirings and etching a portion of the third metal 126 and aportion of the second metal 125 are formed.

As illustrated in FIGS. 40A to 40C, the fourth metal 130 is etched toform metal wirings 134, 135, and 136. Furthermore, a portion of thethird metal 126 and a portion of the second metal 125 are etched to forma first contact 125 a in which the second metal 125 surrounds a sidewallof an upper portion of the pillar-shaped silicon layer 109, a secondcontact 126 a that connects an upper portion of the first contact 125 aand an upper portion of the pillar-shaped silicon layer 109, and a thirdcontact 137 made of the second metal 125 b and the third metal 126 b andformed on the gate line 121 b. Before the formation of the metalwirings, the portion of the third metal 126 and the portion of thesecond metal 125 may be etched. Therefore, misalignment between thefirst contact, the second contact, and the third contact can beeliminated in a direction perpendicular to a direction in which the gateline extends.

The upper portion of the pillar-shaped silicon layer 109 can be made tofunction as an n-type silicon layer or a p-type silicon layer by thedifference in work function between the second metal and silicon withoutforming a diffusion layer in the upper portion of the pillar-shapedsilicon layer 109. Accordingly, a step of forming a diffusion layer inthe upper portion of the pillar-shaped silicon layer can be omitted.

As illustrated in FIGS. 41A to 41C, fifth resists 131, 132, and 133 areremoved.

The description so far has shown a sixth step that includes depositing asecond gate insulating film around the pillar-shaped semiconductor layerand on the gate electrode and the gate line, removing a portion of thesecond gate insulating film on the gate line, depositing a second metal,etching back the second metal, removing the second gate insulating filmon the pillar-shaped semiconductor layer, depositing a third metal, andetching a portion of the third metal and a portion of the second metalto form a first contact in which the second metal surrounds a sidewallof an upper portion of the pillar-shaped semiconductor layer, a secondcontact that connects an upper portion of the first contact and an upperportion of the pillar-shaped semiconductor layer, and a third contactmade of the second metal and the third metal and formed on the gateline.

Thus, a method for producing an SGT which includes forming a fin-shapedsemiconductor layer, a pillar-shaped semiconductor layer, a gateelectrode, and a gate line using two masks and which employs a gate lastprocess and a self-aligned process, the SGT having a structure in whichan upper portion of the pillar-shaped semiconductor layer is made tofunction as an n-type semiconductor layer or a p-type semiconductorlayer by the difference in work function between metal andsemiconductor, has been described.

FIG. 1 illustrates a structure of a semiconductor device obtained by theabove-described production method.

The semiconductor device includes a fin-shaped silicon layer 103 formedon a silicon substrate 101, a first insulating film 104 formed aroundthe fin-shaped silicon layer 103, a pillar-shaped silicon layer 109formed on the fin-shaped silicon layer 103, a first gate insulating film120 formed around the pillar-shaped silicon layer 109, a gate electrode121 a made of a metal and formed around the first gate insulating film120, a gate line 121 b connected to the gate electrode 121 a, made of ametal, and extending in a direction perpendicular to a direction inwhich the fin-shaped silicon layer 103 extends, a second diffusion layer115 formed in an upper portion of the fin-shaped silicon layer 103 and alower portion of the pillar-shaped silicon layer 109, a second gateinsulating film 123 formed around a sidewall of an upper portion of thepillar-shaped silicon layer 109, a first contact 125 a made of a secondmetal and formed around the second gate insulating film 123, a secondcontact 126 b made of a third metal and connecting an upper portion ofthe first contact 125 a and an upper portion of the pillar-shapedsilicon layer 109, and a third contact 137 made of the second metal andthe third metal and formed on the gate line 121 b. The first gateinsulating film 120 is formed around and at bottoms of the gateelectrode 121 a and the gate line 121 b. An outer width of the gateelectrode 121 a is equal to a width of the gate line 121 b.

After the fifth step, the first contact, the second contact, and thethird contact are formed by filling a hole which is present above thegate electrode and the gate line and which has the same shape as thoseof the gate electrode and the gate line. The width of the first contactin a direction perpendicular to a direction in which the gate lineextends is equal to the width of the third contact in the directionperpendicular the direction in which the gate line extends. The width ofthe first contact in the direction perpendicular to the direction inwhich the gate line extends is equal to the width of the gate line inthe direction perpendicular to the direction in which the gate lineextends. The width of the third contact in the direction perpendicularto the direction in which the gate line extends is equal to the width ofthe gate line in the direction perpendicular to the direction in whichthe gate line extends. The width of the first contact in the directionperpendicular to the direction in which the gate line extends is equalto the width of the second contact in the direction perpendicular to thedirection in which the gate line extends.

Therefore, misalignment between the first contact, the second contact,and the third contact can be eliminated in the direction perpendicularto the direction in which the gate line extends.

In the present invention, the upper portion of the pillar-shaped siliconlayer 109 can be made to function as an n-type silicon layer or a p-typesilicon layer by the difference in work function between the secondmetal 125 and silicon without forming a diffusion layer in the upperportion of the pillar-shaped silicon layer 109. Accordingly, a step offorming a diffusion layer in the upper portion of the pillar-shapedsilicon layer can be omitted.

When the second metal 125 has a work function of 4.0 eV to 4.2 eV, whichis near the work function 4.05 eV of n-type silicon, the upper portionof the pillar-shaped silicon layer 109 functions as n-type silicon. Inthis case, the second metal is preferably, for example, a compound(TaTi) of tantalum and titanium or tantalum nitride (TaN).

When the second metal 125 has a work function of 5.0 eV to 5.2 eV, whichis near the work function 5.15 eV of p-type silicon, the upper portionof the pillar-shaped silicon layer 109 functions as p-type silicon. Inthis case, the second metal is preferably, for example, ruthenium (Ru)or titanium nitride (TiN).

The first gate insulating film 120 formed around and at bottoms of thegate electrode 121 a and the gate line 121 b can insulate the gateelectrode 121 a and the gate line 121 b from the pillar-shaped siliconlayer 109 and the fin-shaped silicon layer 103.

Misalignment between the pillar-shaped silicon layer 109 and the gateline 121 b can be eliminated because they are formed by self-alignment.

In the present invention, various embodiments and modifications can bemade without departing from the broad sprit and scope of the presentinvention. Furthermore, the above-described embodiment is provided todescribe one embodiment of the present invention, and the scope of thepresent invention is not limited thereto.

For example, the technical scope of the present invention naturallyincludes a method for producing a semiconductor device in which theconductivity types, p (including p⁺) and n (including n⁺), are reversedfrom the embodiment described above, and a semiconductor device obtainedthrough the method.

What is claimed is:
 1. A method for producing a semiconductor device,comprising: a first step of forming a fin-shaped semiconductor layer ona semiconductor substrate and forming a first insulating film around thefin-shaped semiconductor layer; a second step following the first step,the second step including forming a pillar-shaped semiconductor layerand a first dummy gate formed of a first polysilicon; a third stepfollowing the second step, the third step including forming a seconddummy gate on sidewalls of the first dummy gate and the pillar-shapedsemiconductor layer; a fourth step following the third step, the fourthstep including forming a fifth insulating film left as a sidewall aroundthe second dummy gate, forming a second diffusion layer in an upperportion of the fin-shaped semiconductor layer and a lower portion of thepillar-shaped semiconductor layer, and forming a metal-semiconductorcompound on the second diffusion layer; a fifth step following thefourth step, the fifth step including depositing an interlayerinsulating film, exposing an upper portion of the second dummy gate andan upper portion of the first dummy gate, removing the second dummy gateand the first dummy gate, forming a first gate insulating film aroundthe pillar-shaped semiconductor layer and on inner sides of the fifthinsulating film, depositing a first metal, and forming a gate electrodeand a gate line; and a sixth step following the fifth step, the sixthstep including depositing a second gate insulating film around thepillar-shaped semiconductor layer and on the gate electrode and the gateline, removing a portion of the second gate insulating film on the gateline, depositing a second metal, etching back the second metal, removingthe second gate insulating film on the pillar-shaped semiconductorlayer, depositing a third metal, and etching a portion of the thirdmetal and a portion of the second metal to form a first contact in whichthe second metal surrounds a sidewall of an upper portion of thepillar-shaped semiconductor layer, a second contact that connects anupper portion of the first contact and an upper portion of thepillar-shaped semiconductor layer, and a third contact made of thesecond metal and the third metal and formed on the gate line.
 2. Themethod according to claim 1, wherein the second step includes forming asecond insulating film around the fin-shaped semiconductor layer,depositing the first polysilicon on the second insulating film toperform planarization, forming a second resist for forming the gate lineand the pillar-shaped semiconductor layer so that the second resistextends in a direction perpendicular to a direction in which thefin-shaped semiconductor layer extends, and etching the firstpolysilicon, the second insulating film, and the fin-shapedsemiconductor layer to form the pillar-shaped semiconductor layer andthe first dummy gate formed of the first polysilicon.
 3. The methodaccording to claim 1, wherein the third step includes forming a fourthinsulating film around the pillar-shaped semiconductor layer and thefirst dummy gate, depositing a second polysilicon around the fourthinsulating film, and etching the second polysilicon so that the secondpolysilicon is left on sidewalls of the first dummy gate and thepillar-shaped semiconductor layer to form the second dummy gate.
 4. Themethod according to claim 1, wherein the fourth step includes formingthe fifth insulating film around the second dummy gate, etching thefifth insulating film into a sidewall shape so that a sidewall formed ofthe fifth insulating film is formed, forming the second diffusion layerin the upper portion of the fin-shaped semiconductor layer and the lowerportion of the pillar-shaped semiconductor layer, and forming themetal-semiconductor compound on the second diffusion layer.
 5. Themethod according to claim 3, wherein the fifth step includes depositingan interlayer insulating film, performing chemical mechanical polishingto expose an upper portion of the second dummy gate and an upper portionof the first dummy gate, removing the second dummy gate and the firstdummy gate, removing the fourth insulating film, forming a first gateinsulating film around the pillar-shaped semiconductor layer and oninner sides of the fifth insulating film, depositing a first metal, andetching back the first metal to form the gate electrode and the gateline.
 6. The method according to claim 2, wherein the second stepfurther includes forming a third insulating film on the firstpolysilicon after depositing the first polysilicon on the secondinsulating film to perform planarization.
 7. The method according toclaim 5, further comprising, after the fourth step, depositing a contactstopper film.
 8. The method according to claim 1, further comprising,after the fifth step, removing the first gate insulating film.
 9. Themethod according to claim 1, wherein a metal that forms the firstcontact has a work function of 4.0 eV to 4.2 eV.
 10. The methodaccording to claim 1, wherein a metal that forms the first contact has awork function of 5.0 eV to 5.2 eV.
 11. A semiconductor devicecomprising: a pillar-shaped semiconductor layer; a first gate insulatingfilm formed around the pillar-shaped semiconductor layer; a gateelectrode made of a metal and formed around the first gate insulatingfilm; a gate line made of a metal and connected to the gate electrode; asecond gate insulating film formed around a sidewall of an upper portionof the pillar-shaped semiconductor layer; a first contact made of asecond metal and formed around the second gate insulating film; a secondcontact made of a third metal and connecting an upper portion of thefirst contact and an upper portion of the pillar-shaped semiconductorlayer; and a third contact made of the second metal and the third metaland formed on the gate line.
 12. The semiconductor device according toclaim 11, comprising: a fin-shaped semiconductor layer formed on asemiconductor substrate; a first insulating film formed around thefin-shaped semiconductor layer; and a second diffusion layer formed inan upper portion of the fin-shaped semiconductor layer and a lowerportion of the pillar-shaped semiconductor layer, wherein thepillar-shaped semiconductor layer is formed on the fin-shapedsemiconductor layer, the first gate insulating film is formed around andat bottoms of the gate electrode and the gate line, and the gate lineextends in a direction perpendicular to a direction in which thefin-shaped semiconductor layer extends.
 13. The semiconductor deviceaccording to claim 12, wherein a width of the first contact in adirection perpendicular to a direction in which the gate line extends isequal to a width of the third contact in the direction perpendicular tothe direction in which the gate line extends.
 14. The semiconductordevice according to claim 12, wherein a width of the first contact in adirection perpendicular to a direction in which the gate line extends isequal to a width of the gate line in the direction perpendicular to thedirection in which the gate line extends.
 15. The semiconductor deviceaccording to claim 12, wherein a width of the third contact in adirection perpendicular to a direction in which the gate line extends isequal to a width of the gate line in the direction perpendicular to thedirection in which the gate line extends.
 16. The semiconductor deviceaccording to claim 12, wherein a width of the first contact in adirection perpendicular to a direction in which the gate line extends isequal to a width of the second contact in the direction perpendicular tothe direction in which the gate line extends.
 17. The semiconductordevice according to claim 11, wherein the second gate insulating film isformed around and at a bottom of the first contact.
 18. Thesemiconductor device according to claim 11, wherein the second metalthat forms the first contact has a work function of 4.0 eV to 4.2 eV.19. The semiconductor device according to claim 11, wherein the secondmetal that forms the first contact has a work function of 5.0 eV to 5.2eV.